SN

英

美

abbr.  Saponification Number 皂化值

复数：sns　

医学计算机

BNC.38042

双语例句

• The Au – Sn flip-chip joints were formed at300 and400 ℃ without using any flux.
  不用任何助溶剂金锡倒装晶片连接点可在300-400℃时形成。
• FDA standard products SN serial number verification.
  FDA标准产品SN序列号码验证。
• Effect of Cu, As and Sn on the low ductility region ⅲ of low alloy steel continuous casting slabs
  Cu、As和Sn对低合金钢连铸坯第Ⅲ脆性区的影响
• On Reversibility of Liquid Transition in Sn-based Alloys
  Sn基合金熔体结构转变的可逆性研究
• Besides Cu, Sn, W used in industry, Mo, Bi can be comprehensively utilized as well.
  除可工业利用铜、锡和钨元素外，还可综合利用钼和铋元素。
• AAS method was used for determination of Fe, Sn and Cu in TC10 titanium alloy.
  利用AAS法对TC10钛合金中铁、锡、铜含量进行同时测定。
• Alloying and Compositing of Mg_2 ( Si, Sn) Based Thermoelectric Materials
  Mg2（Si，Sn）基热电材料的合金化和复合化研究
• Influence of Stannum on Microstructure and Properties of TiC_p/ Fe Composite
  Sn对TiCp/Fe复合材料组织与性能影响的研究
• First-principle Study of the Effect of Sn Adatom on ZnO ( 0001)-Zn Polar Surface Adsorbing Oxygen
  Sn对O原子在ZnO（0001）-Zn极性面上吸附影响的第一性原理研究
• In the second part, a geometric inequality on finite points set of spherical space Sn is proved.
  本文讨论了球面型空间的有关度量问题，并给出了球面型空间有限点集的一个不等式。